The 3rd TechSphere Conference: Advancements in AI, Machine Learning, and Cybersecurity (AMC26)

Locations

  • U.K. (Offline): University of Kent
  • Online: Link to be provided by the organizer

Date & Details

  • Date: December 30, 2026
  • Mode: Hybrid (On-site | Online)

Introduction

Building on the legacy of the 2025 ALSA gathering, the American Life and Science Association is proud to present The 3rd TechSphere Conference: Advancements in AI, Machine Learning, and Cybersecurity (AMC26). This premier international forum convenes leading computer scientists, data engineers, and security experts to explore the transformative technologies redefining our digital future.

The 2026 program focuses on the critical convergence of intelligent systems and digital resilience. From the evolution of generative AI and deep learning architectures to breakthroughs in zero-trust security and threat intelligence, AMC26 highlights the innovations necessary to navigate an increasingly automated and interconnected world.

Through visionary keynotes and collaborative workshops, participants will address interdisciplinary solutions to ethical AI development and global data protection. We invite you to join this elite community as we inspire the next generation of tech pioneers to shape a secure and innovative digital landscape.


Conference Agenda

Time (EST) Session Title Participants
08:30 – 09:00 Opening Remarks & Welcome Address
09:00 – 10:15 Keynote I: The Future of Computing: From Cloud Infrastructure to Intelligent Systems Vinod A. Thale (Zhejiang University)
10:15 – 11:00 Coffee Break / Virtual Networking
11:00 – 12:15 Keynote II: Software Engineering for a Changing World: Agile, Scalable, and Sustainable Jian Hu (University of Kent)
12:15 – 14:00 Lunch
14:00 – 15:00 Q&A
15:00 – 15:30 Closing Remarks

Keynote Speakers

Vinod A. Thale

Vinod A. Thale

Electrical and Electronics Engineering

Associate Professor

Zhejiang University

Jian Hu

Jian Hu

Energy Engineering

Doctor

University of Kent

Editorial Team

Editor-in-chief

Vinod A. Thale (Zhejiang University)

Associate Editor

Syed Murawat Abbas Naqvi (Beijing Institute of Technology)

Editorial Board Member

Faisal Rafique (Southern University of Science and Technology), Jian Hu (University of Kent)

All submissions will be screened and peer-reviewed by the reviewers with MDs, PHDs, Doctors of Engineering and associate professors from the universities and research institutes worldwide.

The review process will be double-blind peer-review.

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