Application of Photolithography and Etching Processes in Digital Integrated Circuit Manufacturing

Abstract

As semiconductor technology nodes continue to shrink, the accuracy and coordination of lithography and etching— two key patterning processes in digital integrated circuit manufacturing—directly determine circuit performance and integration levels.This article aims to analyze the key technical points of these two processes. The article first elaborates on the methods of enhancing resolution in lithography technology by utilizing DUV/EUV light sources, as well as the matching relationship between these methods and the lithography resin materials. It also compares the principles and technical characteristics of wet etching and dry etching. This study systematically analyzed key technical aspects of lithography and etching processes to establish an experimental data-driven process parameter optimization model. Findings indicate that development process parameters significantly impact depth of focus, while etching uniformity can be improved by 40% through multi-parameter synergistic optimization. The research provides theoretical foundations and practical guidance for process co-optimization in advanced manufacturing.